Facts and figures
10. – 11.04.2019 Barcelona Tickets & registration

Facts and figures on the Smart Systems Integration

The Smart Systems Integration has evolved into Europe’s leading communications platform in the field of system integration of miniaturized components. Find out more about what makes the event so special.

Smart Systems Integration 2018: the figures

The 2018 Smart Systems Integration conference again proved to be an international source of ideas for science and industry. A total of 319 participants from 19 countries attended 96 conference contributions and 5 keynote speeches.

Venue and concept

Venue and concept

Smart Systems Integration is staged in a different European country each year. In 2018, the event was hosted in Dresden and in 2019 it will be held in Barcelona. The annual change of venue enables the keynote speeches and special sessions to focus on country-specific hot topics and offers a new perspective on the issue of embedding intelligent miniaturized systems each year.

Aaron Johnson, exhibitor of Smart Systems Integration Accumold Corp.

A great event to learn and be on the forefront of smart systems.


Chairman of the committee:

Prof. Dr. Thomas Otto
Fraunhofer ENAS, Chemnitz, Germany

Co-chairman of the committee:

Dr. Günter Lugert
Siemens, EPoSS, Germany

Local Co-Chairmen of the committee:

Dr. Wolfgang Dettmann
Infineon Technologies AG, Germany

Prof. Dr.-Ing. habil. Klaus Kabitzsch
Technische Universität Dresden, Germany

Christoph Kögler
T-Systems Multimedia Solutions GmbH, Silicon Saxony e. V., Germany

Prof. Dr.  Klaus-Dieter Lang
Fraunhofer IZM, Germany

Prof. Dr. Masayoshi Esashi

Tohoku University, Japan

Roger H. Grace

R. Grace Associates, USA

Renzo Dal Molin

Riccardo Groppo
Ideas & Motion, Italy

Annsi Korhonen
Murata Electronics, Finland

Dr. Jochen Langheim
STMicroelectronics International, France

Dr. Reinhard Neul
Bosch, Germany

An Nguyen-Dinh
Vermon, France

Herbert Rödig
Infineon Technologies, Germany

Dr. Willem van Driel
Philips Electronics, the Netherlands

Dr. Larraitz Añorga

Rolf Aschenbrenner
Fraunhofer IZM, Germany

Prof. Dr. Reinhard R. Baumann
Fraunhofer ENAS, Germany

Prof. Dr. Karlheinz Bock
TU Dresden, Germany

Dr.-Ing. Christian Bosshard
CSEM, Switzerland

Dr. Sywert Brongersma
Holst Centre, IMEC, the Netherlands

Bernard Candaele
Thales, France

Prof. Dr. Carles Cané
Centro Nacional de Microelectrónica (CNM-IMB), Spain

Dr. Jo De Boeck
IMEC International, the Netherlands

Prof. Dr. Alfons Dehé
Hahn-Schickard, Germany

Prof. Marc Desmulliez
Heriot-Watt University, Great Britain

Karsten  Dyrbye
Grundfos Holding, Denmark

Dr. Stefan Finkbeiner
Bosch Sensortec, Germany

Prof. Dr. P. J. French
Delft University of Technology, the Netherlands

Uwe Gäbler
Infineon, Germany

Wolfgang Gessner
VDI/VDE-IT, Germany

Dr. Rainer Günzler
Hahn-Schickard, Germany

Dr. Christian Hedayat
Fraunhofer ENAS, Germany

Dr. Harry Heinzelmann
CSEM, Switzerland

Prof. Dr.  Christofer Hierold
ETH Zurich, Switzerland

Prof. Dr. Karla Hiller
Technische Universität Chemnitz, Germany

David Holden
CEA-Léti, France

Dr. Jyrki Kiihamäki
VTT Technical Research Centre of Finland, Finland

Prof. Dr.  Christoph Kutter
Fraunhofer EMFT, Germany

Louis Le Fur
Airbus Group Innovations, France

Dr. Chris Merveille

Prof. Dr. Wilfried Mokwa
RWTH Aachen, Germany

Dr. Eric Moore
University College Cork, Tyndall National Institute, Ireland

Dr. Alexandru Muller
IMT, Romania

Dr. Andreas Nebeling
Elmos, Germany

Prof. Hans-Erik Nilsson
Mid Sweden University, Sweden

Prof. Dr.  Hercules Pereira Neves

Jean-Philippe Polizzi
CEA-Léti, France

Dr. Youri Ponomarev
Analog Devices, Belgium

Dr. Irina V. Popova
Gyrooptics, Russia

Dr. Markus Riester
meisterwerk ventures GmbH, Germany

Dr. Giancarlo Righini
Instituto di Fisica Applicata Nello Carrara Firenze, Italy

Prof. Anders Rydberg
University of Uppsala, Sweden

Prof. Dr. Sven Rzepka
Fraunhofer ENAS, Germany

Dr. Michael Scholles
Fraunhofer IPMS, Germany

Uwe Schwarz
X-FAB MEMS Foundry, Germany

Dr. Rolf Slatter
Sensitec GmbH, Germany

Thomas Stärz
microFAB, Germany

Prof. Jussi Tuovinen
JoyHaptics Ltd, Finland

Jürgen Wolf
Fraunhofer IZM, Germany

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