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Facts and figures
10. – 11.04.2019 Barcelona Tickets & registration

Facts and figures on the Smart Systems Integration

The Smart Systems Integration has evolved into Europe’s leading communications platform in the field of system integration of miniaturized components. Find out more about what makes the event so special.

Smart Systems Integration 2018: the figures

The 2018 Smart Systems Integration conference again proved to be an international source of ideas for science and industry. A total of 319 participants from 19 countries attended 96 conference contributions and 5 keynote speeches.

Venue and concept

Venue and concept

Smart Systems Integration is staged in a different European country under the motto "Creating a smarter future" each year. In 2018, the event was hosted in Dresden and in 2019 it will be held in Barcelona. The annual change of venue enables the keynote speeches and special sessions to focus on country-specific hot topics and offers a new perspective on the issue of embedding intelligent miniaturized systems each year.

SSI_Conference_Dresden_20180411_015
Aaron Johnson, exhibitor of Smart Systems Integration Accumold Corp.

A great event to learn and be on the forefront of smart systems.

Committee

Chairman of the committee:

Prof. Dr. T. Otto,
Fraunhofer ENAS, DE

Co-chairman of the committee:

Dr. S. Finkbeiner,
Bosch Sensortec, EPoSS, DE

W. Gessner,
VDI/VDE-IT, DE

Local co-chairmen of the committee:

Dr. L. Añorga,
CIDETEC, ES

Prof. Dr. C. Cané,
Centro Nacional de Microelectrónica (CNM-IMB), ES

Dr. Luis Fonseca,
IMB-CNM (CSIC) Instituto de Microelectrónica de Barcelona, ES

Dr. C. Merveille,
Ikerlan, ES

R. Aschenbrenner,
Fraunhofer IZM, DE

Prof. Dr. R. R. Baumann,
Fraunhofer ENAS, DE

Prof. Dr. K. Bock,
TU Dresden, DE

Dr. C. Bosshard,
CSEM, CH

Dr. S. Brongersma,
Holst Centre, IMEC, NL

Dr. B. Candaele,
Thales, FR

Prof. Dr. A. Dehé,
Hahn-Schickard, DE

Dr. W. Dettmann,
Infineon Technologies AG, DE

K. Dyrbye,
Grundfos Holding, DK

Prof. Dr. M. Esashi,
Tohoku University, JP

Prof. Dr. P. J. French,
Delft University of Technology, NL

U. Gäbler,
Infineon, DE

Dr. R. Günzler,
Hahn-Schickard, DE

Dr. C. Hedayat,
Fraunhofer ENAS, DE

Dr. H. Heinzelmann,
CSEM, CH

Prof. Dr. C. Hierold,
ETH, CH

Prof. Dr. K. Hiller,
Chemnitz University of Technology, DE

D. Holden,
CEA-LETI, FR

Prof. Dr.-Ing. habil. K. Kabitzsch,
Dresden University of Technology, DE

Dr. J. Kiihamäki,
VTT Technical Research Centre of Finland, FI

C. Kögler,
T-Systems Multimedia Solutions GmbH, Silicon Saxony e. V., DE

Prof. Dr. C. Kutter,
Fraunhofer EMFT, DE

Prof. Dr. K.-D. Lang,
Fraunhofer IZM, DE

L. Le Fur,
Airbus Group Innovations, FR

Prof. Dr. W. Mokwa,
RWTH Aachen, DE

Dr. E. Moore,
University College Cork, Tyndall National Institute, IE

Dr. A. Muller,
IMT, RO

Dr. A. Nebeling,
Elmos, DE

Prof. H.-E. Nilsson,
Mid Sweden University, SE

J.-P. Polizzi,
CEA-LETI, FR

Dr. Y. Ponomarev,
Analog Devices, BE

Dr. I. V. Popova,
Gyrooptics, RU

Dr. M. Riester,
meisterwerk ventures GmbH, DE

Dr. G. Righini,
Instituto di Fisica Applicata Nello Carrara Firenze, IT

Prof. Dr. S. Rzepka,
Fraunhofer ENAS, DE

Dr. M. Scholles,
Fraunhofer IPMS, DE

U. Schwarz,
X-FAB MEMS Foundry, DE

Dr. R. Slatter,
Sensitec GmbH, DE

Prof. J. Tuovinen,
JoyHaptics Ltd, FI

J. Wolf,
Fraunhofer IZM, DE

Members of EPoSS advisory committee

R. Dal Molin,
CAIRDAC SAS, FR

Dr. W. Dettmann,
Infineon Technologies AG, DE

R. Groppo,
Ideas & Motion, IT

A. Korhonen,
Murata Electronics, FI

Dr. J. Langheim,
STMicroelectronics, FR

Dr. R. Neul,
Bosch, DE

A. Nguyen-Dinh,
Vermon, FR

H. Rödig,
Infineon Technologies, DE

Dr. W. van Driel,
Philips Electronics, NL

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